Method of manufacturing piezoelectric element and piezoelectric substrate
AssigneesInterface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
InventorsChen-Chu Hsu, Ying-Hung Tsai, Wei-Chung Chuang, Somnath Mondal
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Abstract
A method of manufacturing a piezoelectric element includes: forming a patterned mask layer over a substrate, in which the patterned mask layer has an opening exposing a portion of the substrate; forming a piezoelectric element in the opening; and removing the patterned mask layer to obtain the piezoelectric element, in which the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion.
Claims5
A method of manufacturing a piezoelectric element, comprising:
- providing a substrate;
- forming a patterned mask layer through a cut or punch process, wherein the patterned mask layer has an opening;
- adhering the patterned mask layer to the substrate, wherein the opening exposes a portion of the substrate;
- forming a piezoelectric element on the portion of the substrate;
- and
- removing the patterned mask layer to obtain the piezoelectric element, wherein the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion, and an included angle between a sidewall of the peripheral portion and a surface of the substrate is in a range of 40° to 100°.
Dependencies are inferred from the claim text.