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US 10,312,429 B2Granted
Magnetoelectric macro fiber composite fabricated using low temperature transient liquid phase bonding
AssigneeEyob LLC
InventorRon Varghese
Life of this patent
Estimating the term…
Abstract
A composite material fabricated using a novel process and materials. The piezoelectric and magnetostrictive layers of the composite material are coated, layered, and bonded using a process known as LTTLP bonding. The resulting magnetoelectric composite fibers are bonded to a polyimide film based copper flexible circuit using a room temperature curing epoxy. The sensor that results is an MEMFC that outperforms conventionally fabricated MEMFCs.
Claims12
A magnetoelectric composite material comprised of:
- a layer of piezoelectric (PE) material;
- a layer of magnetostrictive (MS) material;
- the layer of piezoelectric material bonded to the layer of magnetostrictive material using low temperature transient liquid phase (LTTLP) bonding, forming a composite material;
- the LTTLP bond comprised of:
- titanium, gold, and a solder alloy;
- the titanium used to form an adhesion layer on the PE material and the MS material;
- the gold used to form a bonding layer on the PE material and the MS material;
- and
- the solder alloy used to bond the PE material and MS material together by diffusing into the bonding layers;
- the composite material divided into multiple fibers:
- a flexible circuit;
- the flexible circuit applied to the composite material;
- an epoxy spin coating applied to the combination of the flexible circuit and composite material;
- wherein the solder alloy has a melting point at or below a Curie temperature of the PE material and at or below a Curie temperature of the MS material.
11 more elements
A method of fabricating a composite material with piezoelectric (PE) and magnetostrictive (MS) layers, the method comprising:
- creating a PE adhesion layer by coating one side of a piezoelectric material with a layer of a first metal;
- creating an MS adhesion layer by coating one side of a magnetostrictive material with a layer of the first metal;
- creating a PE bonding layer by coating the PE adhesion layer with a layer of a second metal;
- creating a MS bonding layer by coating the MS adhesion layer with a layer of the second metal;
- creating an PE solder layer by depositing solder alloy on the PE bonding layer;
- creating a MS solder layer by depositing solder alloy on the MS bonding layer;
- pressing the PE solder layer and MS solder layer against one-another while heating to a temperature;
- the temperature no greater than a Curie temperature of the magnetostrictive material;
- thereby bonding the PE and MS materials to each other, resulting in the composite materials;
- slicing the composite material into fibers;
- applying a flexible circuit to the composite material;
- spin coating the composite material and flexible circuit with epoxy;
- and
- vacuum bonding the composite material and flexible circuit.
11 more elements
A composite material fabricated by the process of:
- coating a piezoelectric (PE) material with one or more layers of metal;
- coating a magnetostrictive (MS) material with one more layers of metal;
- creating a first solder layer by depositing solder alloy on the one or more layers of metal of the PE material;
- creating a second solder layer by depositing solder alloy on the one or more layers of metal of the MS material;
- pressing the first solder layer and second solder layer together while applying heat, thereby bonding the PE and ME materials to each other, resulting in a magnetoelectric composite materials;
- slicing the magnetoelectric composite material into fibers;
- applying a flexible circuit to the magnetoelectric composite material;
- spin coating the magnetoelectric composite fibers and flexible circuit with epoxy;
- and
- vacuum bonding the magnetoelectric composite material and flexible circuit;
- thereby creating an MEMFC.
8 more elements
Dependencies are inferred from the claim text.