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US 10,312,425 B2Granted
Semiconductor light-emitting device
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
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Abstract
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
Claims55
A semiconductor light-emitting device, comprising:
- a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion;
- a second lead frame spaced apart from the first lead frame in a first direction and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion;
- a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame;
- and
- a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame, the case including a peripheral edge in top plan view along the first direction and a second direction perpendicular to the first direction;
- wherein the first lead frame includes an extension extending in the second direction and a side surface facing in the second direction, the side surface having a nonlinear configuration in top plan view provided at least by the extension,
- the extension includes a first extension that is extended from the die-bonding portion,
- the case includes a first holding portion that covers a lower surface of the first extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and
- the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within the peripheral edge of the case in plan view.
6 more elements
A semiconductor light-emitting device, comprising:
- a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion;
- a second lead frame spaced apart from the first lead frame and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion;
- a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame;
- and
- a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame;
- wherein the first lead frame includes an extension extending outward from the die bonding portion in top plan view and a side surface facing in an extension direction in which the extension extends, the side surface having a non-linear configuration in top plan view provided at least by the extension,
- the extension includes a first extension that is extended from the die bonding portion,
- the case includes a first holding portion that covers a lower surface of the first extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and
- the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within a peripheral edge of the case in plan view.
6 more elements
A semiconductor light-emitting device, comprising:
- a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion;
- a second lead frame spaced apart from the first lead frame in a first direction and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion;
- a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame;
- and
- a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame, the case including a peripheral edge in top plan view along the first direction and a second direction perpendicular to the first direction;
- wherein the first lead frame includes an extension extending in the second direction and a side surface facing in the second direction, the side surface having a non-linear configuration in top plan view provided at least by the extension,
- the extension includes a small-width thin extension smaller in size in the first direction than both the die bonding portion and the semiconductor light-emitting element and smaller in thickness than the die bonding portion,
- the case includes a first holding portion that covers a lower surface of the small-width thin extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and
- the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within the peripheral edge of the case in plan view.
6 more elements
A semiconductor light-emitting device, comprising:
- a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion;
- a second lead frame spaced apart from the first lead frame and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion;
- a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame;
- and
- a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame;
- wherein the first lead frame includes an extension extending outward from the die bonding portion in top plan view and a side surface facing in an extension direction in which the extension extends, the side surface having a non-linear configuration in top plan view provided at least by the extension,
- the extension includes a small-width thin extension smaller in size in a width direction perpendicular to the extension direction than both the die bonding portion and the semiconductor light-emitting element and smaller in thickness than the die bonding portion,
- the case includes a first holding portion that covers a lower surface of the small-width thin extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and
- the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within a peripheral edge of the case in plan view.
6 more elements
Dependencies are inferred from the claim text.