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US 10,312,415 B2Granted
Flexible electronic assembly with semiconductor die
AssigneeMicrosoft Technology Licensing, LLC
InventorsJames David Holbery, Siyuan Ma, Benjamin Sullivan
Life of this patent
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Abstract
An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.
Claims14
An electronic assembly comprising:
- a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface;
- a semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive;
- an adhesive encapsulant layer arranged on the surface and configured to encapsulate the semiconductor die;
- and
- a flexible cover textile bonded to the surface and to the semiconductor die via the adhesive encapsulant layer.
2 more elements
A fabric-based electronic assembly comprising:
- a polymer membrane having a surface with one or more electrically conductive traces arranged on the surface;
- a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive;
- an adhesive encapsulant layer arranged on the surface and configured to encapsulate the semiconductor die;
- and
- a cover textile bonded to the surface and to the light-emissive semiconductor die via the encapsulant layer.
2 more elements
Dependencies are inferred from the claim text.