Monolithic integration of high voltage transistors and low voltage non-planar transistors
AssigneeIntel Corporation
InventorsKinyip Phoa, Nidhi Nidhi, Chia-Hong Jan, Ting Chang
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AssigneeIntel Corporation
InventorsKinyip Phoa, Nidhi Nidhi, Chia-Hong Jan, Ting Chang
Estimating the term…
High voltage transistors spanning multiple non-planar semiconductor bodies, such as fins or nanowires, are monolithically integrated with non-planar transistors utilizing an individual non-planar semiconductor body. The non-planar FETs may be utilized for low voltage CMOS logic circuitry within an IC, while high voltage transistors may be utilized for high voltage circuitry within the IC. A gate stack may be disposed over a high voltage channel region separating a pair of fins with each of the fins serving as part of a source/drain for the high voltage device. The high voltage channel region may be a planar length of substrate recessed relative to the fins. A high voltage gate stack may use an isolation dielectric that surrounds the fins as a thick gate dielectric. A high voltage transistor may include a pair of doped wells formed into the substrate that are separated by the high voltage gate stack with one or more fin encompassed within each well.
An integrated circuit (IC) structure, comprising:
Dependencies are inferred from the claim text.