Semiconductor device having improved edge trench, source electrode and gate electrode structures
AssigneeSanken Electric Co., Ltd.
InventorsShunsuke Fukunaga, Taro Kondo
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AssigneeSanken Electric Co., Ltd.
InventorsShunsuke Fukunaga, Taro Kondo
Estimating the term…
A semiconductor device may include a device region having one or more active trenches, a field termination region having an edge trench. A depth of the edge trench is larger than a depth of the one or more active trenches. A thickness of an insulation layer in the edge trench is larger than a thickness of an insulation layer in the one or more active trenches. In some embodiments, the first depth is from 1.2 to 2.0 times larger than the second depth, and a first width of the edge trench is 1.5 to 4.0 times larger than a second width of the one or more active trenches. In a cross-sectional view, a gate electrode of the edge trench is laterally offset from the source electrode in a depth direction of the edge trench such that the gate electrode and the source electrode do not overlap.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.