LED illuminator and method of making the same

An LED illuminator, comprising:

• at least one LED chip including a first LED chip;
• and
• an opaque resin member that does not transmit light from the LED chip,
• wherein the LED chip includes:
• a support substrate having an obverse surface, a reverse surface and a side surface located between the obverse surface and the reverse surface;
• a semiconductor layer disposed on the obverse surface of the support substrate;
• and a first electrode formed on the reverse surface of the support substrate,
• the obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer,
• the opaque resin member covers at least a part of the side surface of the support substrate and exposing the peripheral edge portion of the obverse surface,
• the semiconductor layer has a curved surface located at an end of the semiconductor layer in plan view, the curved surface being curved in a recessed shape in a cross-sectional view taken along a plane that is parallel to a thickness direction of the semiconductor layer,
• the semiconductor layer has a first surface and a second surface that faces a side opposite the first surface, the second surface of the semiconductor layer being disposed between the first surface of the semiconductor layer and the obverse surface of the support substrate,
• the first surface of the semiconductor layer is smaller in dimension in a lateral direction perpendicular to the thickness direction than the second surface of the semiconductor layer,
• the LED chip includes a second electrode that is disposed on the first surface of the semiconductor layer,
• the first surface of the semiconductor layer includes an exposed portion that is exposed from the second electrode,
• the curved surface of the semiconductor layer includes a first end and a second end, the first end of the curved surface being connected to the first surface of the semiconductor layer, the second end of the curved surface being connected to the obverse surface of the support substrate, and
• a dimension of the exposed portion of the first surface of the semiconductor layer in the lateral direction is larger than a distance between the first end of the curved surface and the second end of the curved surface in the lateral direction.