Solid-state imaging device and imaging system

A solid-state imaging device comprising:

• a first substrate on which a photoelectric conversion element is arranged;
• a second substrate laminated and disposed on the first substrate, at least a part of a peripheral circuit being arranged in the second substrate, the peripheral circuit including a control circuit and a readout circuit configured to read a signal based on an electric charge of the photoelectric conversion element;
• an electrode portion provided on the first substrate and having a connection surface exposed to outside of the first substrate, the connection surface being provided so as to be electrically connectable toward outside of the first substrate;
• a first substrate connecting portion disposed between the first substrate and the second substrate, the first substrate connecting portion electrically connecting the electrode portion and the second substrate;
• an electrostatic protection circuit provided in the second substrate, the electrostatic protection circuit being electrically connected to the first substrate connecting portion and the peripheral circuit;
• and
• a second substrate connecting portion disposed between the first substrate and the second substrate, the second substrate connecting portion electrically connecting the peripheral circuit disposed on the second substrate and the photoelectric conversion element disposed on the first substrate,
• wherein, when viewed in a lamination direction in which the first substrate and the second substrate are laminated on each other,
• an area of the electrode portion is greater than an area of the first substrate connecting portion connected to the electrode portion, and
• the electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit overlaps the connection surface and does not overlap any of the first substrate connecting portion and the second substrate connecting portion.