Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus

An electronic apparatus, comprising:

• a solid-state image pickup unit comprising:
• a sensor substrate having a pixel region in which photoelectric conversion sections are arranged in an array;
• a circuit on a surface opposed to a light reception surface for the photoelectric conversion sections of the sensor substrate;
• a through hole via in a peripheral region located outside the pixel region and extending to the circuit from the light reception surface of the sensor substrate;
• a pad wiring line directly laminated on the through hole via on the light reception surface in the peripheral region;
• and
• an insulating layer disposed adjacent to the through hole via and opposite the light-receiving surface from the pad wiring line,
• wherein,
• the insulating layer has a first thickness corresponding to the peripheral region and a second thickness corresponding to the pixel region,
• the first thickness is different than the second thickness
• the pad wiring line is disposed above the first thickness of the insulating layer, and
• a light reception opening is disposed above the second thickness of the insulating layer.