Semiconductor device and method for manufacturing same
AssigneeToshiba Memory Corporation
InventorsYasuhito Yoshimizu, Satoshi Wakatsuki, Yohei Sato, Keiichi Sawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeToshiba Memory Corporation
InventorsYasuhito Yoshimizu, Satoshi Wakatsuki, Yohei Sato, Keiichi Sawa
Estimating the term…
According to one embodiment, the plurality of charge storage films are separated in a stacking direction with a second air gap interposed. The plurality of insulating films are provided on side surfaces of electrode layers opposing the charge storage films, on portions of surfaces of the electrode layers continuous from the side surfaces and opposing a first air gap between the electrode layers, and on corners of the electrode layers between the portions and the side surfaces. The plurality of insulating films are divided in the stacking direction with a third air gap interposed and without the charge storage films being interposed. The third air gap communicates with the first air gap and the second air gap between the first air gap and the second air gap.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.