Integrated memory and integrated assemblies
AssigneeMicron Technology, Inc.
InventorYuichi Yokoyama
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AssigneeMicron Technology, Inc.
InventorYuichi Yokoyama
Estimating the term…
Some embodiments include an integrated assembly having a capacitor. The capacitor has a storage node configured as an upwardly-opening container shape. The container shape has a first side surface and a second side surface. The first and second side surfaces are along outer edges of the container shape and are in opposing relation to one another. The second side surface has a lower portion vertically overlapped by the first side surface, and has an upper portion which is not vertically overlapped by the first side surface. A middle-level lattice is adjacent to the first side surface and supports the first side surface. A higher-level lattice is adjacent to the second side surface and supports the second side surface. Some embodiments include integrated memory (e.g., DRAM).
An integrated assembly, comprising:
Integrated memory, comprising:
Dependencies are inferred from the claim text.