Semiconductor light-emitting device and method for producing the same

A method for producing a semiconductor light-emitting device, the semiconductor light-emitting device comprising a substrate having a circuit pattern on each of an upper surface and a lower surface thereof, one or more light-emitting elements being flip-chip mounted on the upper surface of the substrate, and one or more light-emitting elements being flip-chip mounted on the lower surface of the substrate, the light-emitting elements disposed on the upper surface of the substrate and the light-emitting elements disposed on the lower surface of the substrate being disposed so that they are adjacently disposed, when they are seen from above the substrate, the light-emitting elements mounted on the upper surface of the substrate having light-emitting surfaces as upper surfaces thereof, and the light-emitting elements mounted on the lower surface of the substrate having light-emitting surfaces on the substrate side, and the substrate transmitting at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate, and the method comprising:

• a film formation step of applying a dispersion in which conductive particles and an insulating material are dispersed or a dispersion in which conductive particles coated with an insulating material layer are dispersed on a surface of the substrate that transmits light to form a film of conductive particles coated with the insulating material;
• a circuit pattern formation step of irradiating a light flux on the film to sinter the conductive particles of only a region of a part of the film, and thereby form the circuit pattern adhered to the substrate;
• a light-emitting element mounting step of mounting the light-emitting elements having electrodes so that the electrodes contact with the film after the film formation step;
• and
• a connection region formation step of irradiating a light flux on a region of the film that contacts with the electrode through the substrate from the side of the substrate opposite to the side carrying the film to sinter the conductive particles of the region that contacts with the electrode, and thereby form an electrode connection region adhered to the electrode and the surface of the substrate facing the electrode.