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US 10,312,222 B2Granted
Semiconductor package and semiconductor device using the same
AssigneeMediatek Inc.
InventorsWen-Sung Hsu, Shih-Chin Lin, Tao Cheng
Life of this patent
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Abstract
A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
Claims20
A semiconductor package, comprising:
- a substrate;
- a first electronic component disposed on the substrate;
- a first conductive layer;
- a first package body encapsulating the first conductive layer and the first electronic component;
- and
- a solder layer connecting the first conductive layer and the substrate;
- wherein the first conductive layer is embedded in the first package body, and the first conductive layer includes a trace.
4 more elements
A semiconductor package, comprising:
- a substrate;
- a first electronic component disposed on the substrate;
- a first conductive layer;
- a solder layer connecting the first conductive layer and the substrate;
- a first package body encapsulating the first conductive layer and the first electronic component;
- a second conductive layer;
- a second pillar layer connecting the first conductive layer and the second conductive layer;
- and
- a second package body encapsulating the second conductive layer and the second pillar layer;
- wherein the first conductive layer is embedded in the first package body.
7 more elements
Dependencies are inferred from the claim text.