Atomization mechanism for cooling a bond head
AssigneeAsm Technology Singapore Pte Ltd
InventorsYi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu, Jiang Wen Deng
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Abstract
An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
Claims18
An atomization mechanism for cooling a bond head, the atomization mechanism comprising:
- an atomization module configured to receive gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray;
- wherein the atomization module comprises:
- a mixing tube comprising a liquid inlet and a first gas inlet to provide liquid and gas for forming a liquid and gas mixture;
- and
- a conveying tube joined to the mixing tube and comprising a second gas inlet to provide gas for converting the liquid and gas mixture into the atomized spray;
- and
- a conduit configured to convey the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head.
A bonding apparatus comprising:
- a bond head comprising:
- a holding element configured to hold an electronic device;
- a heater configured to heat the holding element;
- and
- a spray inlet located at the bond head and configured to receive an atomized spray into the bond head to cool the heater;
- and
- an atomization mechanism comprising:
- an atomization module configured to receive gas and liquid from a gas supply and a liquid supply respectively to form the atomized spray;
- and
- a conduit configured to convey the atomized spray from the atomization module to the spray inlet located at the bond head.
Dependencies are inferred from the claim text.