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US 10,312,212 B2Granted
Self-adhesive die
AssigneeTexas Instruments Incorporated
InventorRongwei Zhang
Life of this patent
Estimating the term…
Abstract
An apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.
Claims18
A semiconductor package comprising:
- a semiconductor die, including an active side and an opposite back side, the opposite back side shaped as a plurality of nanowires, a plurality of cavities between the plurality of nanowires;
- and
- a substrate having a first side, the opposite back side of the semiconductor die attached to the first side of the substrate.
A semiconductor package comprising:
- a semiconductor die, including an active side and an opposite back side, the opposite back side shaped as a plurality of nanowires, the opposite back side including a plurality of cavities in between the plurality of nanowires;
- a substrate having a first side, the opposite back side of the semiconductor die attached to the first side of the substrate;
- and
- mold compound in the plurality of cavities.
1 more element
Dependencies are inferred from the claim text.