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US 10,312,210 B2Granted
Semiconductor package
AssigneeMediatek Inc.
InventorsChing-Liou Huang, Ta-Jen Yu
Life of this patent
Estimating the term…
Abstract
The invention provides a semiconductor package. The semiconductor package includes a base having a device-attach surface and a solder-ball attach surface opposite to the device-attach surface. A conductive via is disposed passing through the base. The conductive via includes a first terminal surface aligned to the device-attach surface of the base. A semiconductor die is mounted on the base by a conductive structure. The conductive structure is in contact with the first terminal surface of the conductive via.
Claims14
A semiconductor package, comprising:
- a base having a device-attach surface;
- a first conductive via and a second conductive via passing through the base;
- a semiconductor die mounted on the base by a first conductive structure and a second conductive structure, wherein
- the first conductive structure is in direct physical contact and partially overlaps with a first terminal surface of the first conductive via, and
- the second conductive structure is in direct contact and fully overlaps with a second terminal surface of the second conductive via.
2 more elements
A semiconductor package, comprising:
- a base having a device-attach surface comprising a base material;
- a first conductive via and a second conductive via passing through the base;
- a first conductive structure in direct physical contact with a first terminal surface of the first conductive via and the base material in the device-attach surface, forming a first interface between the first conductive structure and the first terminal surface, wherein
- the first conductive structure partially overlaps with the first conductive via such that, in plan view, the first interface has a smaller area than the first terminal surface;
- and
- a second conductive structure is in direct contact and fully overlaps with the second conductive via.
3 more elements
Dependencies are inferred from the claim text.