Copper pillar bump structure and manufacturing method therefor
AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorsXingtao Xue, Chih Ching Ho
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Abstract
A method for manufacturing a metal bump device includes providing a substrate structure including a substrate and a metal layer having a recess on the substrate, forming a metal bump on the recess of the metal layer using a ball placement process, and forming a solder paste on the metal bump using a printing process. The manufacturing time is shorter, the manufacturing efficiency is higher, and the manufacturing cost is lower than conventional manufacturing methods.
Claims20
A method for manufacturing a metal bump device, the method comprising:
- providing a substrate structure including a substrate and a metal layer having a recess on the substrate;
- forming a metal bump on the recess of the metal layer using a ball placement process;
- and
- forming a solder paste on the metal bump using a printing process,
- wherein the metal layer comprises a first metal layer on the substrate, a second metal layer on the first metal layer, and a third metal layer on the second metal layer, the third metal layer having a thickness greater than a thickness of the second metal layer.
A metal bump device, comprising:
- a substrate;
- a metal layer having a recess on the substrate;
- a metal bump on the recess of the metal layer;
- and
- a solder paste on the metal bump,
- wherein the metal layer comprises a first metal layer on the substrate, a second metal layer on the first metal layer, and a third metal layer on the second metal layer, the third metal layer having a thickness greater than a thickness of the second metal layer.
Dependencies are inferred from the claim text.