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US 10,312,205 B2Granted
Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYoun Gyu Han
Life of this patent
Estimating the term…
Abstract
A fan-out semiconductor package includes a semiconductor chip having an active surface, the active surface having a connection pad disposed thereon, and an inactive surface opposing the active surface; an encapsulant encapsulating at least a portion of the semiconductor chip; an insulating layer disposed on the active surface of the semiconductor chip; and a redistribution layer disposed on the insulating layer and electrically connected to the connection pad. The insulating layer includes a low tan delta (Df) dielectric material.
Claims10
A semiconductor package comprising:
- a semiconductor chip having an active surface and an inactive surface opposing the active surface, the active surface having a connection pad disposed thereon;
- an encapsulant encapsulating at least a portion of the semiconductor chip;
- an insulating layer disposed on the active surface of the semiconductor chip, wherein the connection pad is disposed between the insulating layer and the inactive surface;
- a redistribution layer disposed on the insulating layer and electrically connected to the connection pad;
- and
- a heat dissipation member partially embedded in the encapsulant, disposed on a lateral portion of the semiconductor chip, and disposed on a level between the inactive surface of the semiconductor chip and the insulating layer,
- wherein the heat dissipation member is electrically isolated from the redistribution layer and the connection pad of the semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.