Structure and formation method of chip package with antenna element

A method for forming a chip package, comprising:

• forming a first conductive feature over a support substrate;
• disposing a semiconductor die over the support substrate;
• forming a first protective layer over the support substrate to surround the semiconductor die and the first conductive feature;
• removing the support substrate;
• forming a second protective layer over the first protective layer;
• disposing a conductive pin in the second protective layer;
• forming an antenna element over the second protective layer, wherein the antenna element is electrically connected to the conductive pin;
• and
• forming electrical connection between a conductive element of the semiconductor die and the antenna element through the first conductive feature.

A method for forming a chip package, comprising:

• forming a conductive feature over a support substrate;
• disposing a semiconductor die over the support substrate;
• forming a first protective layer to surround the semiconductor die and the conductive feature;
• forming a second protective layer over the first protective layer;
• disposing a conductive pin in the second protective layer;
• forming an antenna element over the second protective layer, wherein the second protective layer is between the antenna element and the semiconductor die, and the antenna element is electrically connected to the conductive pin;
• and
• forming electrical connection between a conductive element of the semiconductor die and the antenna element through the conductive feature.