Semiconductor device package

A semiconductor device package, comprising:

• a lead frame comprising a paddle, a tie bar and a plurality of leads, the tie bar comprising a first portion adjacent to and connected to the paddle and a second portion, the first portion disposed between the paddle and the second portion;
• an electronic component disposed on the paddle;
• a package body encapsulating the electronic component and the lead frame, the package body having an upper surface and a lower surface opposite to the upper surface, wherein the lower surface exposes the paddle and the tie bar;
• a grounding element extending from the upper surface of the package body to the first portion of the tie bar;
• and
• a conductive layer disposed on the upper surface of the package body and electrically connected to the grounding element.

A semiconductor device package, comprising:

• a lead frame comprising a paddle and a connection element;
• an electronic component disposed on the paddle;
• a package body encapsulating the electronic component and the lead frame, wherein the package body includes a lower surface exposing the paddle and the connection element and an upper surface opposite to the lower surface;
• a grounding element disposed in the package body and having a curved sidewall, the grounding element electrically connected to the connection element and exposed from the upper surface;
• and
• a conductive layer disposed on the upper surface of the package body and electrically connected to the grounding element.