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US 10,312,196 B2Granted
Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
AssigneeSK hynix Inc.
InventorsSukwon Lee, Bok Gyu Min
Life of this patent
Estimating the term…
Abstract
A semiconductor package may include a package substrate to which a first semiconductor chip is attached, an encapsulant covering the first semiconductor chip, and an indicator disposed within the semiconductor package. A side surface of the indicator is exposed at a side surface of the semiconductor package, and a width of a vertical section of the indicator parallel with the exposed side surface of the indicator varies as the vertical section of the indicator becomes farther from the side surface of the semiconductor package.
Claims13
A semiconductor package comprising:
- a package substrate to which a first semiconductor chip is attached;
- an encapsulant covering the first semiconductor chip;
- and
- an indicator including an array of indicating blocks disposed within the semiconductor package,
- wherein at least one of the indicating blocks is exposed at a side surface of the semiconductor package, and
- wherein the number of the indicating blocks exposed by a vertical section of the indicator parallel with the side surface of the semiconductor package varies as the vertical section of the indicator becomes farther from the side surface of the semiconductor package.
3 more elements
Dependencies are inferred from the claim text.