Stacked electronics package and method of manufacturing thereof

A method of manufacturing an electronics package comprising:

• coupling a first electrical component to a top surface of an insulating substrate;
• forming a first conductor layer on a bottom surface of the insulating substrate, the first conductor layer extending through at least one via in the insulating substrate to electrically couple with at least one contact pad of the first electrical component;
• coupling a second electrical component to the bottom surface of the insulating substrate such that a portion of the first conductor layer is positioned therebetween;
• and
• forming a second conductor layer on a top surface of the insulating substrate, the second conductor layer extending through another via in the insulating substrate to electrically couple with the first conductor layer;
• wherein the second conductor layer is electrically coupled to at least one contact pad of the second electrical component.

A stacked electronics package comprising:

• a pair of electrical components coupled to opposing surfaces of an insulating substrate in a stacked configuration wherein an active surface of one electrical component faces an active surface of the other electrical component;
• a first conductor layer coupled to a bottommost surface of the insulating substrate and extending through a via in the insulating substrate to electrically couple to one electrical component of the pair of electrical components;
• and
• a second conductor layer coupled to a topmost surface of the insulating substrate and extending through another via in the insulating substrate to electrically couple to the other electrical component of the pair of electrical components;
• wherein a portion of the first conductor layer is positioned between the pair of electrical components.