Package comprising switches and filters

An apparatus comprising:

• a redistribution portion including:
• at least one dielectric layer;
• and
• at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between a first switching means and at least one first filtering means from a plurality of first filtering means;
• a first portion coupled to the redistribution portion, the first portion including:
• the first switching means comprising a plurality of switch interconnects, wherein the first switching means is configured to operate as a switch;
• and
• a first encapsulation layer at least partially encapsulating the first switching means, wherein the first encapsulation layer touches the at least one dielectric layer of the redistribution portion;
• and
• a second portion coupled to the first portion, the second portion including:
• the plurality of first filtering means, each first filtering means comprising a plurality of filter interconnects, wherein each first filtering means is configured to operate as a filter;
• a second encapsulation layer at least partially encapsulating the plurality of first filtering means;
• and
• a passivation layer coupled to the second encapsulation layer, the first encapsulation layer, and the first switching means, wherein the passivation layer is located between the first encapsulation layer and the second encapsulation layer.

A method for fabricating a package, comprising:

• forming a second portion that includes:
• providing a plurality of first filter dies, each first filter die including a plurality of filter interconnects, wherein each filter die is configured to operate as a filter;
• forming a second encapsulation layer that at least partially encapsulates the plurality of first filter, and
• forming a passivation layer over the second encapsulation layer;
• forming a first portion over the second portion, wherein forming the first portion includes:
• providing a first switch die over the passivation layer, the first switch including a plurality of switch interconnects, wherein the first switch is configured to operate as a switch;
• and
• forming a first encapsulation layer that at least partially encapsulates the first switch die;
• and
• forming a redistribution portion over the first portion, wherein forming the redistribution portion includes:
• forming at least one dielectric layer over the first encapsulation layer;
• and
• forming at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between the first switch die and at least one first filter die from the plurality of first filter dies.