Heat sink attached to an electronic component in a packaged device

A method for forming a packaged electronic device, comprising:

• providing a substrate comprising a lead and a pad, wherein:
• the lead comprises:
• a first end proximate to the pad;
• a second end distal to the first end;
• a lead top surface;
• and
• a lead bottom surface opposite to the lead top surface;
• and
• the pad comprises:
• a pad top surface;
• an opposing pad bottom surface;
• and
• a first width;
• attaching a thermally conductive structure to the pad, wherein:
• the thermally conductive structure comprises:
• a first top surface;
• an opposing first bottom surface;
• a first side surface;
• and
• a second width greater than the first width;
• attaching an electronic component to one of the thermally conductive structure or the pad after the step of attaching the thermally conductive structure to the pad;
• electrically coupling the electronic component to the lead;
• and
• forming a package body that encapsulates the electronic component and at least portions of the lead, the pad, and the thermally conductive structure, wherein:
• the package body has a first major surface and a second major surface opposite to the first major surface;
• one of the first bottom surface of the thermally conductive structure or the bottom surface of the pad is exposed in the first major surface of the package body;
• the first side surface of the thermally conductive structure and the first end of the lead are laterally separated so that the first side surface and the first end do not overlap;
• and
• electrically coupling the electronic component to the lead comprises:
• placing the pad and thermally conductive structure within a support structure such that the support structure directly supports the lead and accommodates the thermally conductive structure;
• and
• thereafter attaching an interconnect structure to the lead and the electronic component.

A packaged electronic device comprising:

• a substrate comprising a lead and a pad, wherein:
• the lead comprises:
• a first end proximate to the pad;
• a second end distal to the first end;
• a lead top surface;
• and
• a lead bottom surface opposite to the lead top surface;
• and
• the pad comprises:
• a pad top surface;
• an opposing pad bottom surface;
• a pad side surface extending between the pad top surface and the pad bottom surface;
• and
• a first width;
• a thermally conductive structure, wherein:
• the thermally conductive structure comprises:
• a first top surface;
• an opposing first bottom surface;
• a recessed portion formed extending inward from the first bottom surface;
• and
• a second width;
• and
• the thermally conductive structure is attached to the pad such that:
• the pad is disposed within the recessed portion;
• and
• the thermally conductive structure is attached to the pad top surface and the pad side surface;
• an electronic component coupled to the thermally conductive structure and electrically coupled to the lead;
• and
• a package body encapsulating the electronic component and at least portions of the lead and the thermally conductive structure, wherein:
• the package body has a first major surface and a second major surface opposite to the first major surface;
• and
• the pad bottom surface and portions of the thermally conductive structure are exposed in the first major surface of the package body.