Semiconductor systems having premolded dual leadframes

A semiconductor system comprising:

• a dual leadframe including a first leadframe formed below and linked with a second leadframe, the first leadframe including zones of a first metal thickness and zones of a second metal thickness smaller than the first thickness, and the second leadframe including zones of a third metal thickness and a fourth metal thickness smaller than the third thickness;
• the dual leadframe having no electronic devices located between the first leadframe and the second leadframe;
• and
• at least one semiconductor chip attached to the top surface of the dual leadframe.

A semiconductor system comprising:

• a dual leadframe including a first leadframe formed below and linked with a second leadframe, the first leadframe including zones of a first metal thickness and zones of a second metal thickness smaller than the first thickness, and the second leadframe including zones of a third metal thickness and a fourth metal thickness smaller than the third thickness;
• at least one semiconductor chip attached to the top surface of the dual leadframe;
• and
• locations of the dual leadframe where metal zones of second thickness are aligned with metal zones of fourth thickness, the locations forming spaces suitable for housing electronic components.

A semiconductor system, comprising:

• a first leadframe having zones of a first thickness and a second thickness and having at least one first joint location;
• a second leadframe formed over the first leadframe, the second leadframe having zones of a third thickness and a fourth thickness and having at least one second joint location;
• an electrical connection formed by the at least one first joint location contacting the at least one second joint location;
• and
• a semiconductor device electrically connected to at least one of the first and second leadframes.