Die package component with jumper structure

A die package component with a jumper structure, comprising:

• a first lead frame, having a die connection surface;
• a second lead frame, separated to the first lead frame, furnished with a lead frame connection groove, the lead frame connection groove further including a thermal deformation tolerance allowable route, the second lead frame including a guide-stop structure at one side at least on a vertical route of the lead frame connection groove, the vertical route being perpendicular to an extension direction parallel to the thermal deformation tolerance allowable route, the guide-stop structure being to guide a lead welding portion into the lead frame connection groove and to prevent the lead welding portion from leaving the lead frame connection groove along the vertical route;
• a die, connected on the die connection surface;
• the jumper structure, generating a thermal deformation under a thermal-variable environment, further including:
• a die welding portion, welded to the die;
• a solder, located in the lead frame connection groove;
• and
• the lead welding portion, welded to the lead frame connection groove via the solder, being movable along the thermal deformation tolerance allowable route upon the thermal deformation;
• and
• a package body, at least partly packaging the first lead frame and the second lead frame, completely packaging the die and the jumper structure.