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AssigneeMitsubishi Electric Corporation
InventorsTakanobu Kajihara, Katsuhiko Omae, Shunsuke Fushie, Muneaki Mukuda, Daisuke Nakashima, Masahiro Motooka, Hiroyuki Miyanishi, Yuki Nakamatsu, Junya Suzuki
Estimating the term…
In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.