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US 10,312,177 B2Granted
Thermal interface materials including a coloring agent
AssigneeHoneywell International Inc.
InventorsLiqiang Zhang, Yaqin Mao, Huifeng Duan, Haigang Kang, Ya Qun Liu, Ling Shen, Kai Zhang
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Abstract
The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
Claims20
A thermal interface material comprising:
- at least one polymer;
- at least one thermally conductive filler;
- and
- at least one coloring agent in the form of an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI):
- wherein each R is independently selected from H, alkyl, aryl, and halogen;
- and
3 more elements
A dispensable thermal interface material comprising:
- at least one polymer;
- at least one thermally conductive filler;
- a coloring agent selected from the group consisting of:
- α-Fe2O3;
- α-Fe2O3.H2O;
- Fe3O4;
- and an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI):
- wherein each R is independently selected from H, alkyl, aryl, and halogen;
- and
- and
- at least one solvent.
8 more elements
A thermal interface material comprising:
- at least one polymer;
- at least one thermally conductive filler;
- at least one phase change material;
- and
- at least one coloring agent selected from the group consisting of iron based inorganic pigments and organic pigments.
2 more elements
Dependencies are inferred from the claim text.