High-frequency module

Abstract

A high-frequency module 1a includes: a wiring substrate 2; a plurality of components 3a and 3b that are mounted on an upper surface 2a of the wiring substrate 2; a sealing resin layer 4 that is stacked on the upper surface 2a of the wiring substrate 2; a shield film 6 that covers a surface of the sealing resin layer 4; and a shield wall 5 that is provided in the sealing resin layer 4. The shield wall 5 is formed of two shield wall element bodies 5a and 5b that have straight line shapes in a plan view, and the two shield wall element bodies 5a and 5b are arranged such that the shield wall element bodies each have one end surface that is not exposed at a different peripheral side surface 4b of the sealing resin layer 4.

Dependencies are inferred from the claim text.