Semiconductor device

A semiconductor device comprising:

• a semiconductor element provided with a first electrode and a second electrode;
• a main lead on which the semiconductor element is disposed;
• a first sublead facing the main lead;
• a first wire having a first end and a second end that are connected to the first electrode and the first sublead, respectively;
• a second wire having a first end and a second end, the first end of the second wire being connected to the second electrode, the second wire being disposed on a left side of the first wire as viewed in a thickness direction of the semiconductor element as proceeding along the first wire from the first electrode toward the first sublead;
• a resin package covering the semiconductor element, the main lead, the first sublead, the first wire and the second wire, the resin package having a rectangular shape as viewed in the thickness direction of the semiconductor element,
• wherein the resin package has a first surface and a second surface, the first surface having a normal direction parallel to the thickness direction, the second surface having a normal direction perpendicular to the thickness direction,
• the main lead and the first sublead are exposed from the first surface of the resin package,
• the main lead and the first sublead have a first portion and a second portion, respectively, that are exposed from the second surface of the resin package,
• as viewed in the thickness direction of the semiconductor element, the first end of the second wire is offset toward the first sublead with respect to the first end of the first wire in a first direction parallel to the second surface of the resin package.