Chemical-mechanical polish (CMP) devices, tools, and methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChang-Sheng Lin
Life of this patent
Estimating the term…
Abstract
Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.
Claims20
A device for a chemical-mechanical polishing (CMP) tool, the device comprising:
- a first carrier component configured to position at least one production wafer with regard to a polishing pad;
- a second carrier component, separate from the first carrier component and configured to position at least one embedded dummy disk with regard to the polishing pad;
- a pad conditioner, configured to position a pad conditioning disk over the polishing pad;
- wherein the at least one embedded dummy disk comprises a substrate and a film disposed over the substrate, wherein the second carrier component and the at least one embedded dummy disk are embedded within a housing of the CMP tool, and wherein the CMP tool is configured to polish the at least one embedded dummy disk in preparation for a polishing process for a wafer;
- and
- a handler connected to the first carrier component, the second carrier component, and the pad conditioner, the handler configured to handle the first carrier component to position the at least one production wafer against the polishing pad independently of the second carrier component and configured to handle the second carrier component to position the at least one embedded dummy disk against the polishing pad independently of the first carrier component.
A chemical-mechanical polishing (CMP) tool comprising:
- a housing;
- a platen disposed within the housing;
- a polishing pad disposed on the platen;
- a slurry dispensing device disposed within the housing proximate the platen;
- a handler disposed within the housing proximate the platen;
- a pad conditioner coupled to the handler by a pad conditioning arm, the pad conditioner being disposed over the polishing pad;
- a first carrier coupled to the handler by a first arm, the first carrier being positioned to retain a wafer;
- and
- a second carrier coupled to the handler by a second arm, the second carrier comprising an embedded dummy disk coupled thereto, wherein the embedded dummy disk comprises a substrate and a film disposed over the substrate, and wherein the second carrier and the embedded dummy disk are embedded within the CMP tool within the housing, wherein the first carrier and the second carrier are respectively positioned independently of one another relative to the polishing pad by operation of the first arm and the second arm, respectively.
A chemical-mechanical polishing (CMP) tool comprising:
- a load port coupled to a housing, and being configured to insert a wafer into the housing;
- a rotatable platen disposed within the housing, the rotatable platen configured to support a polishing pad thereon;
- at least one embedded dummy disk disposed within the housing;
- a pad conditioner disposed over the polishing pad;
- a handler disposed within the housing, the handler being coupled to a plurality of arms, wherein:
- a first arm of the plurality of arms couples a first carrier to the handler, wherein the first carrier is configured to retain the wafer for processing;
- a second arm of the plurality of arms couples a second carrier to the handler, independently of the first carrier, wherein the second carrier is configured to retain at least one dummy disk within the housing, the at least one dummy disk comprising:
- a substrate;
- and
- a film on the substrate, the film having a thickness sufficient to reduce or eliminate a need to replace the dummy disk;
- and
- a third arm of the plurality of arms couples the pad conditioner to the handler.
Dependencies are inferred from the claim text.