Single ultra-planar wafer table structure for both wafers and film frames
AssigneeSemiconductor Technologies & Instruments Pte Ltd
InventorsJian Ping Jin, Leng Kheam Lee
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AssigneeSemiconductor Technologies & Instruments Pte Ltd
InventorsJian Ping Jin, Leng Kheam Lee
Estimating the term…
A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.
A wafer table structure providing a wafer table surface suitable for handling wafers, portions of wafers, and film frames on which wafers or portions thereof are mounted, the wafer table structure comprising:
A method for manufacturing a wafer table structure providing a wafer table surface suitable for handling wafers, portions of wafers, and/or and film frames on which wafers or portions thereof are mounted, the method comprising:
A wafer table structure providing a wafer table surface suitable for handling wafers, portions of wafers, and film frames on which wafers or portions thereof are mounted, the wafer table structure comprising:
Dependencies are inferred from the claim text.