Bonding apparatus and method

A bonding apparatus, comprising:

• a wafer stage for holding a wafer;
• a plurality of chip stages for respectively holding a plurality of chips;
• and
• a plurality of chip transporting devices respectively movable from the chip stages to the wafer stage for respectively transporting the chips from the chip stages onto the wafer stage and configured to bond the chips to the same wafer, wherein heaviest weights that the transporting devices are designed to deal with are unequal,
• wherein the chip transporting devices respectively comprise a plurality of pickup members capable of applying unequal suction forces to pick up the chips from the chip stages, and
• the chip transporting devices respectively comprise a plurality of bonding members capable of applying unequal suction forces to hold the chips from the pickup members.

A bonding apparatus, comprising:

• a wafer stage;
• a first chip transporting device movable from and to the wafer stage,
• wherein the first chip transporting device comprises:
• a first pickup member for picking up the first chip from a first chip stage;
• and
• a first bonding member for bonding the first chip to the wafer, wherein the first pickup member and the first bonding member are spatially separated;
• and
• a second chip transporting device movable from and to the wafer stage, wherein the first and second transporting devices are configured to bond chips to a same wafer held by the wafer stage, wherein heaviest weights that the first and second chip transporting devices are designed to deal with are unequal.