Integrated fan-out package having multi-band antenna and method of forming the same

An integrated fan-out package having a multi-band antenna, comprising:

• a semiconductor die;
• a molding layer aside the semiconductor die;
• and
• a plurality of first through integrated fan-out vias through the molding layer and arranged to form a plurality of first dipole antennas;
• and
• a plurality of second through integrated fan-out vias through the molding layer and arranged to form a plurality of second dipole antennas,
• wherein an operating frequency band of the first dipole antennas is different from an operating frequency band of the second dipole antennas, and the first dipole antennas and the second dipole antennas are in a staggered arrangement.

A method of forming an integrated fan-out package having a multi-band antenna, comprising:

• providing a semiconductor die;
• forming a plurality of through integrated fan-out vias aside the semiconductor die, wherein forming the through integrated fan-out vias comprises forming a plurality of dipole antennas;
• and
• forming a molding layer surrounding the through integrated fan-out vias.