Method for forming amorphous silicon multuple layer structure
AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsMei-Ling Chen, Wei-Hsin Liu, Yi-Wei Chen, Ching-Hsiang Chang, Jui-Min Lee, Chia-Lung Chang, Tzu-Chin Wu, Shih-Fang Tzou
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