Nitride film forming method and storage medium
AssigneeTokyo Electron Limited
InventorsHiroki Murakami, Daisuke Suzuki, Takahiro Miyahara
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AssigneeTokyo Electron Limited
InventorsHiroki Murakami, Daisuke Suzuki, Takahiro Miyahara
Estimating the term…
There is provided a nitride film forming method which includes: performing a pretreatment in which a chlorine-containing gas is supplied while heating a substrate to be processed having a first base film and a second base film formed on the substrate to a predetermined temperature, and is adsorbed onto a surface of the first base film and a surface of the second base film; and forming a nitride film on the first base film and the second base film subjected to the pretreatment, by an ALD method or a CVD method, using a raw material gas and a nitriding gas, while heating the substrate to be processed to a predetermined temperature.
A nitride film forming method, comprising:
Dependencies are inferred from the claim text.