Physical vapor deposition (PVD) plasma energy control per dynamic magnetron control

An apparatus for controlling processing of a substrate within a process chamber including a moveable magnetron and at least one power supply, comprising:

• a processor;
• and
• a memory coupled to the processor, the memory having stored therein instructions executable by the processor to configure the apparatus to:
• determine at least an angular position of the moveable magnetron relative to a reference location on a surface of the substrate using positional information of a motor used to position the moveable magnetron;
• and
• modulate a power parameter of the least one power supply based on the determined position of the moveable magnetron.

A substrate processing system, comprising:

• a process chamber, comprising;
• an inner volume;
• a substrate support disposed within the inner volume to support a substrate;
• a target having a front face exposed to the inner volume;
• a movable magnetron disposed proximate a back side of the target opposite the front face and rotatable about a central axis of the substrate support;
• and
• at least one power supply providing power to the process chamber;
• and
• a controller comprising a processor and a memory coupled to the processor, the memory having stored therein instructions executable by the processor to configure the controller to:
• determine at least an angular position of the moveable magnetron relative to a reference location on a surface of the substrate mounted on the substrate support using positional information of a motor used to position the moveable magnetron;
• and
• modulate a power parameter of the at least one power supply based on the determined position of the moveable magnetron.