Vacuum apparatus for vacuum treating substrate

A vacuum apparatus, comprising:

• a vacuum cavity having a body including a top, sidewalls and a bottom;
• a first electrode and a second electrode both located inside the vacuum cavity and opposite to each other;
• at least one positioning element for positioning a substrate arranged between the first electrode and the second electrode;
• and
• an electrostatic elimination assembly,
• wherein the substrate is positioned closer to the first electrode or the second electrode, and the electrostatic elimination assembly can eliminate an electrostatic adsorption between the substrate and the electrode that is closer to the substrate by attracting charged particles to a surface of the substrate which is facing the closer electrode, and
• wherein the closer electrode is provided with a plurality of gas holes, the electrostatic elimination assembly comprises a plasma discharging system and a plasma conveying system, the plasma discharging system comprises an anode and a cathode used to generate the plasma, the anode is the first electrode, the cathode is the second electrode, the plasma conveying system comprises a conveying conduit disposed outside the vacuum cavity and which is connected from a middle of one of the sidewalls of the vacuum cavity to the bottom of the vacuum cavity, so that the plasma generated in the vacuum cavity can flow through the gas holes towards the surface of the substrate which is facing the closer electrode.