Ring member with air holes and substrate processing system including the same

A substrate processing system with an air hole, comprising:

• a chamber including a lower housing and an upper housing;
• an electrostatic chuck in the lower housing to hold a substrate;
• and
• a ring structure to enclose a side surface of the electrostatic chuck, wherein the ring structure includes an air hole extending from a bottom to a top of the ring structure and from the top to an outer side surface of the ring structure.

A substrate processing system, comprising:

• a chamber;
• an electrostatic chuck in the chamber to hold a substrate;
• and
• a ring member on an edge region and a side surface of the electrostatic chuck, wherein the ring member includes:
• a focus ring on the edge region of the electrostatic chuck, and
• a side ring enclosing an outer side surface of the focus ring and the side surface of the electrostatic chuck, and
• an air nozzle extending from a bottom surface of the side ring toward a top portion of the side ring and extending from the top portion of the side ring toward an outer side surface of the side ring member.