Electronic component
AssigneeTaiyo Yuden Co., Ltd.
InventorsTsuyoshi Ogino, Takayuki Sekiguchi, Koji Otsuka
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Abstract
An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.
Claims7
An electronic component, comprising:
- an insulator formed of a material that contains resin;
- an internal conductor including a conductive main body and an outer coating film and provided inside the insulator, the outer coating film being provided on at least a part of a peripheral surface of the conductive main body and having a resistivity higher than the conductive main body;
- and
- an external electrode provided on the insulator and electrically coupled to the internal conductor, wherein
- the insulator includes a first insulating layer that has a bonding surface perpendicular to the one axial direction and a second insulating layer bonded to the bonding surface,
- the internal conductor includes a plurality of pillared conductive members that extend in one axial direction and a plurality of connecting conductive members that each couples predetermined two pillared conductive members among the plurality of pillared conductive members,
- the plurality of pillared conductive members and the plurality of connecting conductive members form a coil portion wound around an axis perpendicular to the one axial direction, and
- the plurality of pillared conductive members each include a first via conductive member that is provided in the first insulating layer and a second via conductive member that is provided in the second insulating layer and bonded to the first via conductive member.
Dependencies are inferred from the claim text.