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US 10,312,007 B2Granted
Inductor formed in substrate
AssigneeIntel Corporation
InventorsMihir K Roy, Mathew J Manusharow, Harold Ryan Chase
Life of this patent
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Abstract
A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.
Claims11
A device comprising:
- a first conductor formed on a first dielectric layer as a partial turn of a coil;
- a second conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
- a vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
- an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
- a single magnetic core disposed within the first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned;
- and
- a fine line formation on the first dielectric layer using fine solder balls to couple to a die.
4 more elements
A device comprising:
- a first copper conductor formed on a first dielectric layer as a partial turn of a coil;
- a second copper conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
- a copper vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
- an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
- a single magnetic core disposed within first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned;
- and
- a fine line formation on the first dielectric layer using fine solder balls to couple to a die.
4 more elements
Dependencies are inferred from the claim text.