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US 10,312,002 B2Granted
Chip component and production method therefor
AssigneeRohm Co., Ltd.
InventorsYasuhiro Kondo, Katsuya Matsuura
Life of this patent
Estimating the term…
Abstract
A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
Claims52
A chip part, comprising:
- a substrate having a front surface and a side surface;
- an electrode formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, the electrode being disposed selectively on a front surface side of the substrate, a first portion of the electrode formed on the side surface being thinner than a second portion of the electrode formed on the front surface;
- an insulating film interposed between the electrode and the substrate;
- an element disposed on the front surface side of the substrate;
- a wiring film that is formed on the front surface of the substrate and is electrically connected to the electrode;
- and
- a resin film that selectively covers the wiring film and has a removed portion from which the wiring is exposed, wherein
- the electrode has an edge portion extended from an edge portion of the removed portion to an inner side of the substrate in a sectional view.
5 more elements
A chip part, comprising:
- a substrate having a front surface and a side surface;
- an electrode formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, the electrode being disposed selectively on a front surface side of the substrate, a first portion of the electrode formed on the side surface being thinner than a second portion of the electrode formed on the front surface;
- an insulating film interposed between the electrode and the substrate;
- and
- an element disposed on the front surface side of the substrate, wherein
- the chip part has another electrode provided across an interval from the electrode and having a line-symmetric shape with the electrode.
3 more elements
A chip part, comprising:
- a substrate having a front surface and a side surface;
- an electrode formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, the electrode being disposed selectively on a front surface side of the substrate, a first portion of the electrode formed on the side surface being thinner than a second portion of the electrode formed on the front surface;
- an insulating film interposed between the electrode and the substrate;
- and
- an element disposed on the front surface side of the substrate, wherein
- the chip part has another electrode provided across an interval from the electrode, and
- the element includes a resistor body formed on the substrate and connected between the two electrodes, wherein
- the chip part further comprises:
- a plurality of resistor bodies including the resistor body;
- and
- a plurality of fuses provided on the substrate and disconnectably connecting each of the plurality of the resistor bodies to the electrodes.
8 more elements
A chip part, comprising:
- a substrate having a front surface and a side surface;
- an electrode formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, the electrode being disposed selectively on a front surface side of the substrate, a first portion of the electrode formed on the side surface being thinner than a second portion of the electrode formed on the front surface;
- an insulating film interposed between the electrode and the substrate;
- and
- an element disposed on the front surface side of the substrate, wherein
- the insulating film is partly exposed on the side surface of the substrate, a part of the side surface being covered with the electrode.
3 more elements
Dependencies are inferred from the claim text.