RFID integrated circuits with antenna contacts on multiple surfaces

A Radio Frequency Identification (RFID) integrated circuit (IC) comprising:

• an electrically conductive IC substrate;
• a circuit region formed within the IC substrate and electrically isolated from the substrate;
• a first circuit block disposed in the circuit region;
• a first antenna contact disposed on a first surface of the IC substrate and electrically coupled to the first circuit block;
• and
• a second antenna contact disposed on a second surface of the IC substrate different from the first surface, wherein the electrically conductive IC substrate electrically couples the second antenna contact to the first circuit block.

A Radio Frequency Identification (RFD) integrated circuit (IC) comprising:

• an electrically conductive IC substrate formed of a first type of semiconductor material;
• a circuit region within the IC substrate and formed of the first type of semiconductor material;
• an electrically conductive barrier region formed within the IC substrate of a second type of semiconductor material different than the first type, wherein the barrier region electrically isolates the circuit region from the IC substrate;
• a first circuit block disposed in the circuit region;
• a first antenna contact disposed on a first surface of the IC substrate and electrically coupled to the first circuit block;
• and
• a second antenna contact disposed on a second surface of the IC substrate opposite the first surface, wherein the electrically conductive IC substrate electrically couples the second antenna contact to the first circuit block.