Simulation method, simulation apparatus, and simulation program
AssigneeSumitomo Heavy Industries, Ltd.
InventorsYoshitaka Ohnishi, Daiji Ichishima, Shuji Miyazaki
Life of this patent
Estimating the term…
Abstract
A coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including plural particles is performed. Here, numerical calculation of a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation is performed with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time, to perform a simulation of the heat conduction phenomenon of the simulation target.
Claims9
A computer program product embodied on a tangible, non-transitory computer-readable data storage device, the computer program product causes a computer to execute a coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including a plurality of particles, the computer program product comprising:
- computer code for performing numerical calculation of a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time to perform a simulation of the heat conduction phenomenon of the simulation target,
- wherein in a case where a sign of a rate of temperature change of the simulation target and a sign of an acceleration of temperature change thereof are equal to each other, an attenuation coefficient of the motion equation is set to be smaller than an attenuation coefficient at a current time point,
- wherein in a case where the sign of the rate of temperature change of the simulation target and the sign of the acceleration of temperature change thereof are different from each other, the attenuation coefficient of the motion equation is restored to an original value calculated from the heat conduction equation, and a virtual mass which is a parameter corresponding to a mass in the motion equation is increased to be greater than a virtual mass at a current time point, and
- wherein when the virtual mass exceeds an upper limit value, the virtual mass is set to the upper limit value.
A simulation apparatus that performs a coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including a plurality of particles, comprising:
- a storage unit that stores a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time;
- a central processing unit that performs numerical calculation of the motion equation stored in the storage unit to calculate a temperature distribution of the simulation target;
- and
- an output unit that outputs a result of the numerical calculation performed by the central processing unit,
- wherein in a case where a sign of a rate of temperature change of the simulation target and a sign of an acceleration of temperature change thereof are equal to each other, an attenuation coefficient of the motion equation is set to be smaller than an attenuation coefficient at a current time point,
- wherein in a case where the sign of the rate of temperature change of the simulation target and the sign of the acceleration of temperature change thereof are different from each other, the attenuation coefficient of the motion equation is restored to an original value calculated from the heat conduction equation, and a virtual mass which is a parameter corresponding to a mass in the motion equation is increased to be greater than a virtual mass at a current time point, and
- wherein when the virtual mass exceeds an upper limit value, the virtual mass is set to the upper limit value.
Dependencies are inferred from the claim text.