US 10,310,686 B2 · Rigid trackpad for an electronic device

Abstract

A laminated stack, such as a trackpad, is assembled by coupling components using an adhesive system. Assembly of the laminated stack includes forming an adhesive-spacing component on a first substrate, forming an adhesive-alignment-holding component on the first substrate in a perimeter around the adhesive-spacing component, forming a bonding component by filling an area within the perimeter with liquid adhesive, and bonding the first substrate to a second substrate by curing the bonding component. The first substrate and the second substrate may each be one of a touch-sensing component and a cover component. The adhesive-spacing component maintains a space between the first substrate and the second substrate while the bonding component cures. The adhesive-alignment-holding component maintains alignment of the first substrate and the second substrate while the bonding component cures.

Claims9

Dependent claims

A computing structure for an electronic device, comprising:

a cover;
a touch-sensing component positioned below the cover;
and
an adhesive layer coupling the cover to the touch-sensing component, comprising:
an alignment-holding component defining a perimeter;
a spacing component positioned within the perimeter and formed from a cured liquid adhesive material;
and
a bonding component filling a space within the perimeter around the spacing component, the bonding component bonding the cover to the touch-sensing component;
wherein
the bonding component is formed from the liquid adhesive material;
and
the cured liquid adhesive material has a higher stiffness than the alignment-holding component.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/411,733Filed 20 Jan 2017 · us provisional application

Priority

11 Jul 2016

Published

US 2018/0011565 A111 Jan 2018

Granted

4 Jun 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

G06F 1/169
Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675: the I/O peripheral…
B32B 37/003
Involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality: to avoid air inclusion
B32B 37/10
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by the pressing technique, e.g. using action of vacuum…
B32B 37/1284
Characterised by using adhesives: application of adhesive

Rigid trackpad for an electronic device

Life of this patent

Rigid trackpad for an electronic device

Life of this patent

Abstract

Claims9