Translucent conductive film
AssigneeNitto Denko Corporation
InventorsTomohiro Takeyasu, Ikuo Kawamoto, Hitoshi Morita, Akira Arima
Life of this patent
Estimating the term…
Abstract
A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.
Claims6
A translucent conductive film comprising:
- a film substrate, a metal wiring layer provided as a pattern, and a colored layer,
- the film substrate having a plurality of protrusions on a surface at a side where the metal wiring layer is provided,
- the metal wiring layer having a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm,
- the colored layer being provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.
A translucent conductive film comprising:
- a film substrate having a plurality of protrusions on both surfaces thereof;
- a first metal wiring layer provided over one of the surfaces of the film substrate;
- a first colored layer provided on the first metal wiring layer;
- a second colored layer provided over the other surface of the film substrate;
- and
- a second metal wiring layer provided on the second colored layer,
- each of the first and second metal wiring layers having a line width of greater than 5 μm but less than 8 μm, and a thickness of greater than or equal to 0.1 μm but less than 0.5 μm,
- the first colored layer being laminated on a main surface of the first metal wiring layer at a side opposite to the film substrate but not provided on a side surface of the first metal wiring layer,
- the second colored layer being laminated on a main surface of the second metal wiring layer on a film substrate side but not provided on a side surface of the second metal wiring layer.
Dependencies are inferred from the claim text.