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US 10,310,574 B1Granted
Electronic apparatus with heat-dissipation system and heat-dissipation device thereof
AssigneeWistron Corporation
InventorsYing Tzu Chou, Chien-Chung Chang, Te-Lung Wu
Life of this patent
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Abstract
An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations.
Claims6
A heat-dissipation device configured to be disposed in an electronic apparatus, wherein the heat-dissipation device comprises:
- a bottom base;
- a heat-dissipation structure comprising:
- a heat-dissipation base rotatably disposed on the bottom base;
- and
- a plurality of heat-dissipation fins disposed on the heat-dissipation base;
- and
- a driving mechanism configured to selectively rotate the heat-dissipation structure to one of a plurality of predetermined orientations,
- wherein the driving mechanism comprises:
- a first connection element connected to the heat-dissipation structure;
- a first magnetic element disposed on the first connection element;
- a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field;
- a second connection element pivoted on the first connection element;
- a second magnetic element disposed on the second connection element;
- and
- a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field,
- wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field.
13 more elements
An electronic apparatus with a heat-dissipation system, comprising:
- a housing;
- a heat-dissipation device comprising:
- a bottom base located in the housing;
- a heat-dissipation structure rotatably disposed on the bottom base;
- and
- a driving mechanism configured to rotate the heat-dissipation structure;
- a fan disposed in the housing, and configured to generate an airflow passing through the heat-dissipation structure;
- a plurality of sensors disposed in the housing, and configured to generate a plurality of sensing signals;
- and
- a processing device selectively rotating the heat-dissipation structure to one of the predetermined orientations according to the sensing signals, so as to enhance the intensity of the airflow passing through the heat-dissipation structure,
- wherein the driving mechanism comprises:
- a first connection element connected to the heat-dissipation structure;
- a first magnetic element disposed on the first connection element;
- a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field;
- a second connection element pivoted on the first connection element;
- a second magnetic element disposed on the second connection element;
- and
- a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field,
- wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field.
16 more elements
An electronic apparatus with a heat-dissipation system, comprising:
- a housing;
- a heat-dissipation device comprising:
- a bottom base located in the housing;
- a heat-dissipation structure rotatably disposed on the bottom base;
- and
- a driving mechanism configured to rotate the heat-dissipation structure;
- a plurality of fans disposed in the housing, and configured to generate an airflow passing through the heat-dissipation structure;
- and
- a processing device configured to detect an operation condition of the fans, and generating an operation signal,
- wherein the processing device controls the driving mechanism to make the heat-dissipation structure rotate to a predetermined orientation according to the operation signal,
- wherein the driving mechanism comprises:
- a first connection element connected to the heat-dissipation structure;
- a first magnetic element disposed on the first connection element;
- a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field;
- a second connection element pivoted on the first connection element;
- a second magnetic element disposed on the second connection element;
- and
- a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field,
- wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field.
16 more elements
Dependencies are inferred from the claim text.