Wafer scale test interface unit and contactors
AssigneeNuvotronics, LLC
InventorsRick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
Life of this patent
Estimating the term…
Abstract
Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
Claims21
A wafer level test interface device, comprising a device interface layer having a plurality of coaxial transmission lines extending therethrough from a first surface of the layer to an opposing second surface of the layer, the transmission lines having respective ends spaced relative to one another at the first surface separated by a first distance and having respective ends spaced relative to one another at the second surface separated by a second distance which is larger than the first distance, wherein the coaxial transmission lines comprise a center conductor suspended in air and surrounded by conductive shielding.
A method of forming a wafer level test interface device by a sequential build process, comprising:
- sequentially depositing a plurality of layers, wherein the layers comprise one or more layers of a conductive material and one or more layers of a sacrificial material, the plurality of layers collectively providing a device interface structure having a plurality of coaxial transmission lines extending therethrough from a first surface of the layer to an opposing second surface of the layer, the transmission lines comprising a center conductor suspended in an airspace and surrounded by conductive shielding and the transmission lines having respective ends spaced relative to one another at the first surface separated by a first distance and having respective ends spaced relative to one another at the second surface separated by a second distance which is larger than the first distance;
- and
- removing the sacrificial material to provide the airspace between the center conductor and conductive shielding.
Dependencies are inferred from the claim text.