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US 10,309,987 B2Granted
Probe and probe card including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYu-Kyum Kim, Gyu-Yeol Kim, Jae-Won Kim
Life of this patent
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Abstract
A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.
Claims20
A method comprising:
- providing a device under test (DUT) to a test chamber;
- performing testing on the DUT using a probe;
- removing the DUT from the test chamber;
- and
- packaging the DUT into a semiconductor package,
- wherein the probe comprises:
- a beam configured to transmit a test signal to the DUT, the beam extending in a length direction and having a first end portion and a second end portion aligned in the length direction;
- and
- at least two tips disposed on the first end portion of the beam and configured to contact adjacent terminals of the DUT and transmit the test signal to the DUT,
- wherein the at least two tips are arranged at an angle with respect to the length direction of the beam, and
- wherein the at least two tips overlap one another in a second direction of the beam perpendicular to the length direction of the beam.
8 more elements
A method comprising:
- providing a device under test (DUT) to a test chamber;
- performing testing on the DUT using a probe card;
- removing the DUT from the test chamber;
- and
- packaging the DUT into a semiconductor package,
- wherein the probe card comprises:
- a printed circuit board (PCB) including a test pattern through which test signals for testing the DUT flow;
- a first probe including:
- a beam connected to the test pattern;
- and
- at least two first tips arranged on the beam with respect to one another in a direction that is at a predetermined angle relative to a length direction of the beam and configured to contact power pads of the DUT;
- and
- a second probe connected to the test pattern, the second probe including a second tip configured to contact a signal pad of the DUT,
- wherein the at least two first tips overlap one another in a width direction of the beam, the width direction being perpendicular to the length direction of the beam.
11 more elements
A method comprising:
- providing a device under test (DUT) to a test chamber;
- performing testing on the DUT using a probe card;
- removing the DUT from the test chamber;
- and
- packaging the DUT into a semiconductor package,
- wherein the probe card comprises:
- a printed circuit board (PCB) including a test pattern through which test signals for testing the DUT flow;
- and
- a first probe including:
- a beam connected to the test pattern;
- and
- at least two first tips arranged on the beam with respect to one another in a direction at a predetermined angle relative to a length direction of the beam and configured to contact power pads of the DUT,
- wherein the at least two first tips overlap one another in a width direction of the beam, the width direction being perpendicular to the length direction of the beam.
10 more elements
Dependencies are inferred from the claim text.