Temperature-controlled module for electronic devices and testing apparatus provided with the same

A temperature-controlled module of electronic device, comprising:

• a base board, including a fluid route connected spatially with a cooling-fluid source to provide a cooling fluid;
• an electronic-device carrier assembly, laid over the base board, including a plurality of electronic-device holding cavities to contain respectively a plurality of electronic devices and a plurality of through holes positioned respectively above the plurality of electronic-device cavities, a dry-air flowing space being formed between the plurality of electronic-device holding cavities and the respective plurality of through holes, the fluid route being connected spatially with the dry-air flowing space;
• and
• a dry-air supply device, supplying a dry air to the dry-air flowing space;
• wherein the cooling fluid is used to cool down the plurality of electronic devices, and the dry air is used to prevent the plurality of electronic devices from condensation of moisture.

A testing apparatus, comprising:

• a material-inlet zone, being to accommodate a plurality of electronic devices;
• a temperature-controlled zone, being to use a temperature-controlled module to lower temperatures of the plurality of electronic devices to a specific temperature, the temperature-controlled module including a temperature-controlled tray, an electronic-device carrier assembly and a dry-air supply device, the temperature-controlled tray being to receive a cooling fluid, the dry-air supply device being to provide a dry air to the electronic-device carrier assembly;
• a testing zone, being to test the plurality of electronic devices that the temperatures thereof have been lowered to a specific temperature;
• a material-outlet zone, being to accommodate the plurality of electronic devices that have been already examined (called as the examined electronic devices);
• and
• at least one shipment device, being to convey the plurality of electronic devices around the material-inlet zone, the temperature-controlled zone, the testing zone and the material-outlet zone;
• wherein the cooling fluid is used to cool down the plurality of electronic devices, and the dry air is used to prevent the plurality of electronic devices from condensation of moisture.